Aluminum Nitride Ceramic Parts

High thermal conductivity ceramic for electronic packaging,

heat dissipation, and advanced semiconductor applications.

What is Aluminum Nitride Ceramic?

Aluminum nitride ceramic (AlN) is a high-performance advanced ceramic known for its excellent thermal conductivity and strong electrical insulation properties.

Unlike many traditional ceramics, aluminum nitride offers thermal conductivity close to some metals while maintaining excellent electrical insulation, making it an ideal material for heat dissipation in electronic systems.

Aluminum nitride ceramics are widely used in power electronics, semiconductor equipment, LED modules, and electronic packaging, where efficient heat management and electrical insulation are critical.

Key Features of Aluminum Nitride Ceramic

High Thermal Conductivity
Aluminum nitride offers thermal conductivity much higher than most oxide ceramics, making it ideal for heat dissipation applications.
Excellent Electrical Insulation
Despite its high thermal conductivity, AlN maintains strong electrical insulation performance.
Low Thermal Expansion
Its coefficient of thermal expansion is close to that of silicon, making it suitable for semiconductor applications.
Good High-Temperature Stability
Aluminum nitride ceramics maintain stable performance at elevated temperatures.
Excellent Thermal Management Performance
AlN is widely used in electronic substrates and heat spreaders due to its ability to efficiently transfer heat.
Good Chemical Stability
The material shows good resistance to many corrosive environments and industrial conditions.

Technical Properties of Aluminum Nitride Ceramic

The following table summarizes the typical physical, mechanical, thermal, and electrical properties of aluminum nitride ceramic (AlN). These values are provided for reference and may vary depending on material grade, manufacturing process, and application requirements.

Property	Unit	Typical Value	Notes
Material Name	—	Aluminum Nitride Ceramic	AlN Ceramic
Material Type	—	Non-oxide ceramic	Advanced technical ceramic
Chemical Formula	—	AlN	Aluminum Nitride
Color	—	Light gray	Typical appearance
Crystal Structure	—	Hexagonal (Wurtzite)	Stable structure
Porosity	%	<1	Dense sintered ceramic
Machinability	—	Limited	Usually diamond grinding

Property	Unit	Typical Value	Notes
Density	g/cm³	3.26	Typical value
Water Absorption	%	0	Dense material
Specific Heat	J/kg·K	~740	At 25 °C
Thermal Diffusivity	m²/s	~7 ×10⁻⁵	High thermal diffusivity

Property	Unit	Typical Value	Notes
Young’s Modulus	GPa	~310	Typical value
Shear Modulus	GPa	~125	Typical value
Poisson’s Ratio	—	0.24	Typical value
Vickers Hardness	HV	1100 – 1200	High hardness
Flexural Strength	MPa	300 – 350	Typical value
Compressive Strength	MPa	~2100	Typical value
Fracture Toughness	MPa·m½	2.5 – 3	Typical value

Property	Unit	Typical Value	Notes
Maximum Continuous Operating Temperature	°C	1000	In air
Maximum Short-Term Temperature	°C	1200	Short exposure
Thermal Conductivity	W/m·K	170 – 200	Very high conductivity
CTE (25–1000 °C)	×10⁻⁶ /°C	4.5	Low thermal expansion
Melting Point	°C	2200	Aluminum nitride

Property	Unit	Typical Value	Notes
Dielectric Constant (1 MHz)	—	8.5 – 9	Typical value
Loss Tangent	—	~0.0003	Low dielectric loss
Dielectric Strength	kV/mm	15 – 20	Typical value
Volume Resistivity	ohm·cm	≥10¹⁴	At room temperature
Electrical Insulation	—	Excellent	High resistivity

*All values shown are typical material properties and are provided for reference only. Actual values may vary depending on material grade, manufacturing process, and testing conditions.